- 95 m²
- Cleanroom class: 100-10.000
- Acoustic noise: < 58dB
- Temperature stability: +/- 0.2K
- Rel. humidity: 48% +/- 2%
- Vibration isolated foundation
- High purity compressed air (redundant)
- High purity water
- Vacuum
- Nitrogen, Oxygen, Freon, Argon
See here for more information.
ITO CLWS300
- Production system
- Smallest feature sizes: < 0.5µm (binary)
- Max. substrate size: Ø 300 mm
- Max. substrate thickn.: 25 mm
- Wavelength: 405 nm
- Positioning increment: rad.: 0.6 nm; azim.: 1'' @ 600 rpm
- Write speed (typ.): on-axis: 9 mm/h; off-axis: 4 mm/h
ITO CLWSF300
- Research system
- Structures on curved substrates (lenses, mirrors)
- Smallest feature sizes: < 0.5µm (binary)
- Max. substrate size: Ø 300 mm
- Max. substrate thickn.: > 25 mm
- Wavelength: 405 nm
See here for more information.
ICP Plasma Etching Tool
- Vacuum loadlock
- Substrate diameter up to 200 mm
- Processes: CF4
- Materials: SiO2, Si, plastics, ...
Schneider ALi 200 with Fisba µPhase DCI2
- 6 inch (150 mm) interferometer
- Twyman-Green type
- Equipped with two motorized stages
- Used for aspheric testing with computer generated holograms (CGH)
Leica Leitz Ergoplan
- Motorized and software-controlled Microscope
- Measuring and Inspection Tasks
- Lens-magnification 5x - 100x
- Adjustments of all component
- Selection of contrast methods is motor-controlled
- 2048px x 2048px CCD based sensor
Veeco Dimension 3100 Nanoman
- Tapping-Mode AFM
- Sub-nm height-measurement
- Substrate diameter < 100mm
Sentech FTP500
- Recipe based reflectometer for layer thickness measurements
- Measurement time < 100ms
- Precision < 0,3nm
- Thickness 50nm - 5µm