Laboratory Equipment

On this side you'll find our Laboratory Equipment

  • 95 m²
  • Cleanroom class: 100-10.000
  • Acoustic noise: < 58dB
  • Temperature stability: +/- 0.2K
  • Rel. humidity: 48% +/- 2%
  • Vibration isolated foundation
  • High purity compressed air (redundant)
  • High purity water
  • Vacuum
  • Nitrogen, Oxygen, Freon, Argon

3DO

See here for more information.

ITO CLWS300

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  • Production system
  • Smallest feature sizes: < 0.5µm (binary)
  • Max. substrate size: Ø 300 mm
  • Max. substrate thickn.: 25 mm
  • Wavelength: 405 nm
  • Positioning increment: rad.: 0.6 nm; azim.: 1'' @ 600 rpm
  • Write speed (typ.): on-axis: 9 mm/h; off-axis: 4 mm/h
ITO CLWSF300

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  • Research system
  • Structures on curved substrates (lenses, mirrors)
  • Smallest feature sizes: < 0.5µm (binary)
  • Max. substrate size: Ø 300 mm
  • Max. substrate thickn.: > 25 mm
  • Wavelength: 405 nm

See here for more information.

ICP Plasma Etching Tool

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  • Vacuum loadlock
  • Substrate diameter up to 200 mm
  • Processes: CF4
  • Materials: SiO2, Si, plastics, ...

 

Schneider ALi 200 with Fisba µPhase DCI2

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  • 6 inch (150 mm) interferometer
  • Twyman-Green type
  • Equipped with two motorized stages
  • Used for aspheric testing with computer generated holograms (CGH)

Leica Leitz Ergoplan

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  • Motorized and software-controlled Microscope
  • Measuring and Inspection Tasks
  • Lens-magnification 5x - 100x
  • Adjustments of all component
  • Selection of contrast methods is motor-controlled
  • 2048px x 2048px CCD based sensor

Veeco Dimension 3100 Nanoman

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  • Tapping-Mode AFM
  • Sub-nm height-measurement
  • Substrate diameter < 100mm
Sentech FTP500
  • Recipe based reflectometer for layer thickness measurements
  • Measurement time < 100ms
  • Precision < 0,3nm
  • Thickness 50nm - 5µm
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